A Teflon®-insulated copper wire that is coated with a high temperature adhesive layer. The adhesive layer is heated with the melting iron (a type of soldering iron), i.e. by moving the melting tip over the wire, the wire adheres to the desired length on the printed circuit board. In this way, exact and straight wiring bridges are achieved. Since the adhesive layer does not stick at temperatures between-55°C and +125°C, the wire can be handled without any problems. If necessary, the bonded wire can easily be
removed from the printed circuit board without damaging it. Preleg Wire® is a registered trademark of Preleg Inc.
RECOMMENDED FOR APPLICATIONS WHERE WIRE IS EXPOSED TO AGGRESSIVE CLEANING AGENTS AT ELEVATED TEMPERATURES.
